(www.gawkwire.com) – Four leading Dutch telecom innovators will be showcasing their products and services during the GSMA Mobile World Congress in China, at the Shanghai New International Exhibition Centre (SNIEC). Being the largest telecom event in Asia, MWC Shanghai represents mobile operators, device manufacturers, technology providers, vendors and content owners from across the world and attracts over 250 exhibitors and close to 30,000 visitors each year. The event offers insight into the latest developments in telecom. The initiative for the Dutch Pavilion was taken by Teleena, a leading European MVNE. Visitors of the Dutch Pavilion will learn about the very latest developments in Mobile Data Connectivity, Diameter routing and interworking, Cloud Communications, Voice and Messaging services.

Selected companies are:

  • Teleena – Leading Mobile Service Enabler (MVNE) providing Mobile Data Connectivity Services to companies such as KLM, Huawei, Vodafone and expanding its global reach
  • BroadForward – provider of Next Generation Diameter Signaling Controller and multi-protocol interworking, twice nominated for Best Mobile technology by the GSMA
  • CM Telecom – provider of a platform for SMS, Push, Apps, Payments & Voice, boasting customers such as Parkmobile, IKEA, JetairFly, Eurovision song contest, Unicef and many more
  • Voipro International – Provider of global cloud communication solutions for small-medium and large enterprises, introducing a unique fixed mobile solution, worldwide available

Bianca Wiebenga of Teleena says, “Asia is the largest market for LTE, followed by North America and Western Europe. The Dutch pavilion is fully geared to contribute to the success of telecom in Asia”. She further added “Teleena is very proud to be the initiator of the very first Dutch Innovation Pavilion at MWC Shanghai.”

The Dutch Pavilion can be found in Hall 4 at booth B.30.
Come and meet Dutch telecom innovators at GSMA Mobile Congress in Shanghai 15-17 July at the Dutch Pavilion Stand W4.B30
Listen to Dutch Innovations on the Innovation platform, 17 July 11:00h, Hall 4



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